Electromigration is the physical phenomenon of mass transport in metallization structures (interconnects) when the metallization is subject to stresses induced by high electrical current density.
Electromigration is most significant in applications where current densities are high, such as in microelectronics, semiconductors, etc. As the size of integrated circuits (ICs) decrease and the required circuits remain roughly the same, current densities must increase and the effects of electromigration become more significant.
